Directed self-assembly for nanofabrication and device integration

Topic: Directed self-assembly for nanofabrication and device integration

Speaker: (Linda) Yi (Ph.D candidate, Stanford)

Abstract / Description: 

As semiconductor scaling trend continues, directed self-assembly (DSA) provides an inspiring guiding principle and vision for nanofabrication and device integration. For a long time DSA was widely investigated to fabricate periodic and uniform nanostructures over large area. In this talk I will first talk about the flexible control of aperiodic DSA patterns and the application towards next generation lithography. Then I will demonstrate the first 7 nm contact patterning using DSA and a systematic design strategy that links technology node requirements to DSA process and materials. Sub-DSA Resolution Assist Features are also introduced as an effective solution to reduce DSA defectivity. In the last part I will talk about the future of DSA for novel device fabrication.

Bio: 

Linda Yi is a Ph.D. candidate at Stanford University, where she did research on directed self-assembly as the next generation nanofabrication technology with Prof. H.-S. Philip Wong. Prior to her PhD she received her BS in Physics from Peking University in China, 2010. Her research combines electrical engineering and material sciences.  She received the SPIE BACUS Photomask scholarship in 2014, which is awarded every year to only one student in the U.S. with exceptional achievements in the field of optical tooling and semiconductor manufacturing technologies.

For additional questions about this series, please contact:

Dr. Richard Dasher, SystemX Executive Director, 650.725.3621

Ms. Miho Nishi, SystemX Administrative Associate, 650.725.3626

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