External Presentations: Heterogeneous 3D Microsystems: Design, Fabrication, and Packaging (plenary talk)

Event Details:

Thursday, August 20, 2020 - Friday, August 21, 2020

Location

DARPA ERI Summit

Professor Philip Wong

Topic: External Presentations: Heterogeneous 3D Microsystems: Design, Fabrication, and Packaging (plenary talk)

Speaker: Prof. Philip Wong - Electrical Engineering - Stanford University

Abstract / Description:

Plenary Session: Heterogeneous 3D Microsystems: Design, Fabrication, and Packaging by Prof. Philip Wong, EE

Agenda: https://eri-summit.darpa.mil/2020-agenda

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