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Future of AI Hardware Enabled by Advanced Packaging

Event Details:

Thursday, April 23, 2026
4:30pm - 5:30pm PDT

Location

Bldg. 320-105
United States

This event is open to:

Faculty/Staff
Members
Students

Abstract:

Chiplet architectures are becoming foundational to the continued economic and power-efficient scaling of AI hardware and edge computing. As Moore’s Law slows, the convergence of system integration and advanced packaging has emerged as a critical enabler at the intersection of technology and architecture. This keynote will explore how heterogeneous integration—spanning 2.5D and 3D hybrid bonded architectures—is driving AMD’s industry-leading roadmap to optimize power, performance, area, and cost (PPAC). Beyond packaging, the talk will highlight the broader system-level innovations required to integrate diverse chiplets into cohesive, high-performance modules. Topics will include chiplets for AI, system integration challenges, interconnect strategies, and solutions for large-scale chiplet-based systems.

Speaker:

Raja Swaminathan

Dr. Raja Swaminathan is the Corporate Vice President of Heterogeneous Integration Technologies at AMD, spearheading the development of AMD's advanced packaging and heterogeneous integration roadmap. He also leads the Optics technology development at AMD, driving innovation in high-speed optical interconnects and photonics integration.With a distinguished career spanning roles at Intel, Apple, and now AMD, Dr. Swaminathan's expertise in design-technology co-optimization and dedication to optimizing power, performance, area, and cost (PPAC) have led to significant technological advancements such as EMIB, Apple's Mx packages, 3D V-Cache, and 3.5D architectures for AI accelerators.Dr. Swaminathan holds a PhD from Carnegie Mellon University and an undergraduate degree from IIT Madras. With over 100 patents and more than 40 published papers to his name, he was recently recognized as an IEEE Fellow and serves as a technical advisor to multiple startups. His unwavering commitment to heterogeneous integration continues to drive the boundaries of silicon technology. He also shares his insights on life and leadership, drawing lessons from the semiconductor industry, on his LinkedIn profile.

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