5G Communication Challenges and Directions

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Topic: 
5G Communication Challenges and Directions
Thursday, February 7, 2019 - 4:30pm to 5:30pm
Venue: 
Allen 101X
Speaker: 
Dr. Mike McCloud - VP of Engineering - Qualcomm
Abstract / Description: 

We have now officially entered the 5G Era with many commercial networks and devices launching globally in the first half of 2019. While the first phase of 5G NR, based on 3GPP Release 15, primarily focuses on enhanced mobile broadband, our vision for 5G encompasses so much more. 5G is designed to scale for a wide range of devices, services, spectrum bands and deployment types. We are just at the beginning of the 5G evolution, and future 5G NR releases are poised to bring even better capabilities and efficiencies for mobile broadband and deliver new designs targeting automotive, industrial applications, and more.

Join this seminar to see how 5G NR is already enabling new and enhanced mobile experiences today, learn what the continued 5G NR evolution in Release 16 and beyond will bring, and understand how 5G is working hand-in-hand with AI advancements to transform the wireless edge.

Bio: 

Dr. Mike McCloud is a Vice President of Engineering at Qualcomm Technologies Inc. He joined Qualcomm in 2006, and holds over 50 U.S. Patents in the areas of signal processing and architectural design for wireless modems and chipsets.  He is currently the project engineering lead for Qualcomm’s next generation multimode 5G modems  and is responsible for all aspects of the modem design and commercialization across hardware, firmware, and core modem systems design. He has previously been the Qualcomm Snapdragon chipset lead on the industry’s first 1Gbps LTE multimode solution and was a founding systems team member for Qualcomm’s first LTE modem where he led the overall downlink design. Prior to joining Qualcomm, Mike worked at several wireless startup companies in the WiFi and WAN space and was an Assistant Professor at the University of Pittsburgh from 2003 to 2005. He received a Ph.D. and M.S.EE. in electrical engineering from the University of Colorado at Boulder and a B.S.E.E. from George Mason University.