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This talk will give an overview of the current state of the art in advanced packaging and explain the motivation for pursuing multi-die in-package solutions. We will look at the long history of multi-chip modules and explain why the technology has seen a recent resurgence. Since economics drives all commercial technology, we will look at the pros and cons of pursuing a multi-die implementation, in particular, how increased silicon cost has made formerly expensive packaging solutions look more attractive.
Liam Madden is an Adjunct Professor and Technical Director of the SystemX Alliance at Stanford. He recently retired from the semiconductor industry where he spent over 40 years developing microprocessors, ASICS and FPGA’s. Prior to his retirement he was Executive VP and GM of the Wired and Wireless Group at Xilinx where he drove the 5G and Wired Communications business. While heading up hardware R&D at Xilinx, he led the development of the highly successful 28nm, 20nm, 16nm and 7nm FPGA families. He was responsible for the introduction of chip stacking technology at 28nm, leading the industry in integrating multiple devices on a Silicon Interposer for which he received the 2013 Semi Award. He co-authored a chapter on interposers in “Integration in VLSI Circuits, Implementation Technologies and Applications.”
Over his career he contributed to a range of industry leading products including: high performance and low power microprocessors (Alpha and StrongArm at DEC), embedded processors and IP (MIPS) and consumer devices (Xbox 360 at Microsoft). Mr. Madden holds a BE degree from University College Dublin, an M.Eng. degree from Cornell University, is an Adjunct Professor at UCD, a Fellow of the Institute of Engineers of Ireland and a Board Member of Science Foundation Ireland.
