SystemX Affiliates: login to view related content.
*To receive email announcements and live stream information for upcoming seminars, please subscribe to the SystemX Seminar/EE310 Mailing list here.
Demand for performance has always been infinite. Today with the emergence of artificial intelligence, augmented and virtual realities along with the constraints of green compute that statement has never been more true. However, to continue the promise of steady, predictable performance gains has never been more challenging, now that the value add of transistor scaling is slowing down. The result is the industry is going through a transition from decades of dependance on transistor scaling to a new brave world of advanced packaging. This talk will go through examples of how advanced packaging is for the first-time improving performance and what more can be done in the years to come.
Bryan Black received his Ph.D. in Electrical and Computer Engineering from Carnegie Mellon. With almost 30 years of experience, Black has had the honor of working at Motorola, Intel, AMD, and now as CEO of Chipletz which he co-founded. He has done a little of everything from devices to circuits to microarchitecture to DRAM to test to packaging to manufacturing. Formerly a Senior Fellow at AMD, Black led the technology developments leading to the multi-chip module and stacked die products across the AMD's portfolio, including the design of high-bandwidth memory (HBM) and its first implementation in the "Fiji" GPU. These designs form the foundation for many of today's system-in-package implementations for AI and high-performance computing across the industry.
