Skip to:

External Presentations: Heterogeneous 3D Microsystems: Design, Fabrication, and Packaging (plenary talk)

SystemX Affiliates: login to view related content.

Topic: 
External Presentations: Heterogeneous 3D Microsystems: Design, Fabrication, and Packaging (plenary talk)
Thursday, August 20, 2020 - 11:45am to Friday, August 21, 2020 - 11:55am
Venue: 
DARPA ERI Summit
Speaker: 
Prof. Philip Wong - Electrical Engineering - Stanford University
Abstract / Description: 

Plenary Session: Heterogeneous 3D Microsystems: Design, Fabrication, and Packaging by Prof. Philip Wong, EE

Agenda: https://eri-summit.darpa.mil/2020-agenda

External Presentations