Heterogeneous Integration Poster Session - Monday, November 8th, 2021 - 11:00 AM-12:00 PM Pacific Time
Please note: you must register for the conference in order to receive the Gather.town e-poster session link. To register, contact kagtarap@stanford.edu.
| Poster # | Student Name | Poster Title | Advisor | PDF/Video |
|---|---|---|---|---|
| 1 - FMA | Athanasios Ramkaj | Multi-GHz Ultra-Low Jitter High-Linearity ADCs in Heterogeneous Integration | Boris Murmann | PDF & Video |
| 2 - FMA | Yimeng Qin, Heungdong Kwon, & Yujui Lin | Thermal Modeling of a Heat Flux Sensor for Body Core Temperature Measurement | Kenneth Goodson | PDF & Video |
| 3 - FMA | Jillian Anderson & Chi Zhang | Miniature silicon vapor chambers for die-level heat spreading | Kenneth Goodson | PDF & Video |
| 4 - Seed | Qianying Wu | Development of a Novel Vertical Wicking µ-Cooler (VWµ-cooler) for the Numerous-layer 3D IC Platform | Kenneth Goodson | PDF & Video |
| 5 - Seed | Dennis Rich | Cooling Ultra-Dense 3D ICs | Subhasish Mitra | PDF & Video |
| 6 | Michelle Chen & Cagil Koroglu | Wide Bandgap Nitrides Deposited at Low Temperature for Heterogeneous Integration | Eric Pop | PDF & Video |
| 7 | Sumaiya Wahid | Study of High-κ Dielectric Interface and Bias Stress Stability in Indium Tin Oxide FETs | Eric Pop | PDF & Video |
| 8 | Kirstin Schauble | Raman-Based Defect Metrology of 2D Semiconductors Enables Faster Heterogeneous Integration | Eric Pop | PDF & Video |
